Determination of the curing reaction heat and glass transition temperature of thermosetting resins is crucial for understanding their characteristics.

The figure above shows the DSC curve of the epoxy resin curing reaction. In the first heating scan, the DSC curve exhibits a baseline shift indicative of the glass transition near 60°C, and an exothermic peak corresponding to the curing reaction is observed between 120°C and 245°C. After rapid cooling of the sample, the second heating scan shows a higher glass transition temperature due to curing, and the curing exotherm is no longer observed. This indicates that the curing reaction was essentially completed during the first heating cycle.

The DSC-500C Differential Scanning Calorimeter is capable of not only testing the curing reaction and glass transition of epoxy resins but also investigating phase transitions in inorganic materials, melting and crystallization processes of polymers, polymorphism in pharmaceuticals, and the solid-to-liquid ratio in fats and other food products. As a classic thermal analysis instrument that measures thermal effects under controlled temperature programs, the DSC-500C from Shanghai Jiezhun has found widespread application in research and development, process optimization, quality inspection and quality control (QC), and failure analysis across various materials and chemical fields.

Key Technical Specifications